Abstract:
In the first part of this talk, I will introduce the 3D sensor-CMOS integration technology that we developed at ams AG in the period from 2006-2012, for medical imaging application. I will discuss process development, structure, microscopy, and strengths and limitations of the technology. In the second part of the talk, I will discuss activities at OIST in the period 2012-2015, with a focus on advanced electron microscopy capabilities and results. These include semiconductor nanoparticle TEM and GPA strain analysis, high temperature TEM, holography, and in operando device TEM. In conclusion, I will briefly mention possible topics for future research in CMOS-detector technology.

担　　当：Yasuo Arai（arai.yasuo -at- kek.jp)