SOI量子イメージセンサ・コンソーシアム

Call for May 2020 SOI MPW run

We would like to call participants for the next SOI pixel MPW run. The schedule of the MPW run is as follows.

  • Deadline of expression of interest : Jan. 17, 2020
  • Fix submission and mask area: March 6, 2020
  • Deadline of submission : May 7, 2020
  • Scheduled deliver of the chips : end of Sep. 2020

Intended wafer is P-type single SOI wafer with 145nm BOX, ~5kOhmcm resistivity. If you want to use other type of wafer, please consult with us.

Please send following information to yasuo.arai@kek.jp by Jan. 17th.

======= required information ========

  • Name, affiliation and e-mail address of contact person.
  • Required chip area.
  • Short description of your chip function.
  • Tell us if you have any special request (3D integration, backside process, thickness, additional chips etc.)

=================================

If we can not get enough submissions to fulfill the mask area, we may postpone or cancel the MPW run.

[MPW run information]

------ prices -------

Prices for chip submission are;
(1 USD~110 Yen or 1 Euro~120 Yen)

  • 2.90 mm square : 2.8 MYen
  • 4.45 mm square : 5.3 MYen
  • 6.00 mm square : 8.8 MYen
  • Other size : consultation required

- Consumption Tax will be added to all the price for Japanese user.
- For foreign user, shipping and handling fees will added.
- Academic user can receive discount from above prices. Please ask H-Repic Negishi-san (negishi@h-repic.co.jp).
- Number of diced chip delivered to you is about 22 chips/submission.

You can also ask following options to Lapis;

  • Ceramic Packaging : 770 kYen/5chips + 290kYen/additional 5chips
  • Process repeat : 3.22 MYen/wafer
  • Technical assist : 27 kYen/hour

- Please consult other requests to H-Repic. Since the packaging cost at Lapis is very high, H-Repic is planning to handle the packaging by themselves. Detail will be announced later.

 MPW run web page (id / password requested)

---- related body ----

This MPW run is sponsored by SOI Quantum Imaging Sensor Consortium .

All contract will be handled by HAYASHI-REPIC CO., LTD.

Technical support will be available through A-R-Tec Co.

Last modified: 2019.12.23

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